发明名称 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSOR
摘要 PROBLEM TO BE SOLVED: To deteriorate patterning characteristics, even though a chemical amplification type resist after pattern exposure is exposed to basic gas. SOLUTION: This substrate processor is obtained by connecting a housing chamber 1, provided with at least one of an applying part for applying the photosensitive resin film of a chemical amplified type to a substrate, the developing part of the photosensitive resin film, an applying part for applying surface active agent to the substrate and the bake part of the substrate bake part of the substrate and an exposure chamber 2 of photosensitive resin film via a carrying chamber 4 made into an acid atmosphere. Thus, the basic gas brought into from another device is completely neutralized in the chamber 4, to make an environment within the chamber 4 neutral or weakly acidic atmosphere. Thus, even at the time of being exposed to the basic atmosphere for a long period, especially before stoppage of a deice caused by an accident, the basic atmosphere is neutralized by acid, thereby the photosensitive resin film is prevented from becoming slightly soluble and being disabled to form a pattern as the result. In addition, an expendable material such as a chemical filter, etc., and basic gas monitoring monitor are dispensed with.
申请公布号 JP2001015404(A) 申请公布日期 2001.01.19
申请号 JP19990181926 申请日期 1999.06.28
申请人 MATSUSHITA ELECTRONICS INDUSTRY CORP 发明人 TANAKA SEIJI
分类号 H05K3/28;B65G49/00;G03F7/20;H01L21/027;(IPC1-7):H01L21/027 主分类号 H05K3/28
代理机构 代理人
主权项
地址