| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain the subject composition without reflow-cracking when a copper lead frame and an organic base board are used and useful for adhering semiconductor elements to a support material by containing a specific arylnadiimide, a specific diluent, a radical initiator and a filler. SOLUTION: This resin paste composition contains (A) an arylnadiimide expressed by formula I (R is a monovalent or divalent organic residue; (x) is 1 or 2), (e.g. a compound expressed by formula II), (B) a diluent having a radically reactive unsaturated double bond, (C) a radical initiator and (D) a filler. Preferably, the amount of the ingredient A to be blended is 1-50 pts.wt., the amount of the ingredient B to be added is 0.5-50 pts.wt., the amount of the ingredient C to be blended is 0.01-50 pts.wt. and the amount of the ingredient D to be blended is 5-95 pts.wt. Preferably, the ingredients A to D and (E) one or more compounds selected from dimer diols and their derivatives and/or (F) a liquid rubber component are homogeneously dispersed in the composition.</p> |
