TWO-COLOR RESIN SEALING METHOD FOR IC AND COB

摘要

PROBLEM TO BE SOLVED: To provide a method for performing the two-color resin sealing of a tansparent resin and an opaque resin for IC and COB. SOLUTION: The sealing of a transparent resin 14 is performed by thick film printing or potting and the transparent resin 14 is set to molds 15, 16 in a semicured state to be pressurized to flatten the upper surface of the transparent resin 14 and an opaque resin 19 having a black color or other color is injected in the remaining cavity to be cured while perfectly curing the transparent resin 14.