发明名称 TIN-BISMUTH ALLOY ELECTROPLATING BATH AND PLATING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a tin-bismuth alloy electroplating bath capable of obtaining a film having excellent solderability even after heating treatment. SOLUTION: This bath contains (A) at least one kind selected from the stannous salt of alkanesulfonic acid and the stannous salt of alkanolsulfonic acid, (B) at least one kind selected from the bismuth salt of alkanesulfonic acid and the bismuth salt of alkanolsulfonic acid, (C) at least one kind selected from alkanesulfonic acid and alkanolsulfonic acid, (D) a nonionic surface active agent, (E) an oxidation preventive and (F) a monohydroxynaphthalene compd.
申请公布号 JP2001011687(A) 申请公布日期 2001.01.16
申请号 JP19990185898 申请日期 1999.06.30
申请人 NE CHEMCAT CORP 发明人 KATO YASUO
分类号 C25D3/60;C25D7/00;C25D7/12;(IPC1-7):C25D3/60 主分类号 C25D3/60
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