| 摘要 |
PROBLEM TO BE SOLVED: To obtain a subminiaturized sensor with reduced noise satisfying the application and performance along the needs of the electronic device miniaturization. SOLUTION: A circuit board is divided into a plurality of boards (circuit board 1 and circuit board 2) to have a size properly accommodated on a rear side of a sensor element 13, and bare chips (not resin-packaged) are employed to the utmost for circuit components 4-12 to be mounted on the circuit boards and they are laid out so that they are not in contact with each other. The circuit board 1 on which the sensor element 13 is mounted and other circuit board 2 are vertically stacked to obtain a multi-layer, gaps 18, 19 are resin- packaged to make the sensor module stereoscopic, thereby reducing the projection area and realizing subminiaturization. |
