| 摘要 |
<p>PROBLEM TO BE SOLVED: To enable a wiring board to be improved in heat-resistant properties, electrical insulating properties, and profitability by a method wherein a truncated cone projection is formed on the backside of a both-sided metal plated laminate opposite to its chip mount surface, a prepreg and a metal foil are laminated on the front surface, and a hollow prepreg is stacked on the backside, and these components are thermocompressed into a laminated board. SOLUTION: Etching resist is applied on all the surface of a glass cloth-base both- sided metal plated laminated board, the backside is etched halfway, a truncated cone protrusion on the center surface of the board opposite to its other surface where a chip is mounted is left, and the board provided with a both-sided circuit d equipped with a center truncated cone protrusion e is formed by etching carried out from both its sides. A hollow prepreg g and a metal foil a are arranged on the backside, and a prepreg f and a metal foil a are arranged on the surface. These components are thermocompressed under vacuum into a both-sided metal plated multilayer board h. A part of the board other than a chip mounting part is covered with a protective resist and ground to enable a metal surface which serves as a chip mount to be exposed, and a chip is bonded for the formation of a semiconductor plastic package.</p> |
