| 摘要 |
PROBLEM TO BE SOLVED: To freely control the timing of cooling work after a heating processing and to secure the uniform characteristic of a semiconductor substrate in the various processing steps of a semiconductor wafer. SOLUTION: An arm mechanism 110 takes out a semiconductor wafer 200 where the processing of a former process is terminated. The semiconductor wafer kept by respective arms 112 and 114 is arranged in the upper face position of a transfer base 100. The semiconductor wafer 200 is kept by three erect pins 140, the respective arms 112 and 114 are extended, the respective erect pins 140 are lowered and the semiconductor wafer is placed on the upper face of a cooling plate 130 and is cooled. Then, the erect pins 140 are raised again, the semiconductor wafer 200 is arranged in the positions of the respective arms 112 and 114. The semiconductor wafer is kept again by the respective arms 112 and 114, and the erect pins 140 are lowered. The semiconductor wafer is transferred to the processing position of the next process and is arranged. |
