| 摘要 |
PROBLEM TO BE SOLVED: To prevent inferior bonding by reforming the eccentricity of a ball caused by abnormal discharge or the like. SOLUTION: A ball 4 is made at the tip of a wire 2 by fusing, by discharge the tip of the wire 2 led out from the tip of a capillary 1, and then the eccentricity of the ball is reformed by applying ultrasonic vibration to the capillary 1 until this ball 4 abuts on the electrode 6 of the semiconductor pellet 5. |
