| 摘要 |
A wafer adhering device for automatically adhering wafers on a polishing plate for polishing the surface of the wafers. The wafers are taken out from a wafer cassette one by one, and transferred to an adhesive coating section by a carrying means. The surface of the wafers are coated by the adhesive wax in the coating section. After the adhesive coated wafers are carried out from the coating section by the carrying means, the wafers are taken out from the carrying means and are reversed the surfaces thereof by a reverse chuck means. The polishing plate is waited on the position where the reversed wafers are arrived, and the wafers are adhered onto the surface of the polishing plate. |
