| 摘要 |
PROBLEM TO BE SOLVED: To improve yield of an object processed by preventing the adhesion of very fine dust to an object to be treated, the breakage of an element through discharging, and so on, by eliminating charging of the object. SOLUTION: A coating and developing apparatus is provided with a carry-in/ carry-out mechanism 10, which carries untreated and treated wafers W by means of a carry-in/carry-out means 13 and a treating mechanism unit 20 which carries wafers W to a treating mechanism (21a-21f), which treats the wafers W with solutions by supplying at least a prescribed treating solution to the wafers W carried appropriately to treating sections by means of a carry means 22. The carry-in/carry-out means 13 is provided with an arm 14, which can move the wafers W in the horizontal, vertical, and rotational directions and an ion irradiating means 40 which causes ions to be irradiated upon the wafers W is provided in at least either one of the moving regions of the means 13 and 22. Therefore, the electrostatics charged in the wafers W can be eliminated by having the ions generated irradiated by the ion irradiating means 40 upon the wafers W. |
