| 摘要 |
<p>A disc-like workpiece (10), such as a semi-conductor wafer, is positioned relative to a grooved grinding wheel (32) by the steps of rotating the workpiece and wheel about respective parallel axes, performing a preliminary grind, measuring the profile of the workpiece rim, axially adjusting the wheel position, performing a second preliminary grind and repeating the steps until the desired accuracy of the profile is achieved. A method and apparatus is also described for forming the edge of a forming wheel, for example using electro-discharge machining.</p> |
