发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR IMPROVING DRY ETCHING RESISTANCE OF PHOTOSENSITIVE RESIN COMPOSITION |
摘要 |
A photosensitive resin composition comprising a resin soluble in an alkaline solution, a photosensitive substance, and a compound containing a phenolic hydroxyl group and having a parameter (P) of 30 or more, the parameter (P) being represented by the following formula (1): parameter (P)= <u> 13.0 x number of hydroxyl groups of additive </u> number of benzene rings of additive + <u> 14.0 x number of diazo coupling reaction sites of additive </u> number of benzene rings of additive (1), wherein the number of diazo coupling reaction sites represents the number of the carbon atoms being present at an o-position or p-position to a hydroxyl group in the compound and having no substituents; and a method for improving dry etching resistance of a photosensitive resin composition using the photosensitive resin composition. The photosensitive resin composition can be used for forming a good pattern and has a high sensitivity and excellent resistance to dry etching.
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申请公布号 |
WO0102909(A1) |
申请公布日期 |
2001.01.11 |
申请号 |
WO2000JP03925 |
申请日期 |
2000.06.16 |
申请人 |
CLARIANT INTERNATIONAL LTD.;KAWATO, SHUNJI;TAKAHASHI, SHUICHI |
发明人 |
KAWATO, SHUNJI;TAKAHASHI, SHUICHI |
分类号 |
H01L21/027;G03F7/004;G03F7/022;(IPC1-7):G03F7/022;C08L101/00 |
主分类号 |
H01L21/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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