发明名称 ELECTROLYTIC COPPER PLATING SOLUTION
摘要 PROBLEM TO BE SOLVED: To effectively plate openings of a high aspect ratio by incorporating at least one soluble copper salt, electrolyte and at least one or more brightening agent compounds of specific concentration into the subject solution. SOLUTION: This electroplating composition contains the brightening agent at a concentration of at least about 1.5 mg/l, more preferably about 2 to 25 mg/l. The brightening agent is a compound having at least one or more sulfur atoms and preferably having a sulfide and/or sulfonic acid group and the compound containing a group of R'-S-R-SO3X is more preferable. In the formula, R: an alkyl (inclusive of cycloalkyls), a heteroalkyl, an aryl group of a heteroalicyclic compound all of which may be arbitrarily substituted, X: paired ion, such as Na or K, R': hydrogen or -S-R-SO3X or a substituent of a larger compound. As a concrete brightening agent n,n-dimethyl-dithiocarbamic acid-(3- sulfopropyl)ester, or the like, is cited.
申请公布号 JP2001003191(A) 申请公布日期 2001.01.09
申请号 JP20000144780 申请日期 2000.05.17
申请人 SHIPLEY CO LLC 发明人 BARSTAD LEON R;RYCHWALSKI JAMES E;LEFEBVRE MARK;MENARD STEPHANE;MARTIN JAMES L;SCHETTY ROBERT A III;TOBEN MICHAEL
分类号 C25D3/38;C25D5/48;C25D7/00;C25D7/12;H01L21/288;H05K3/42;(IPC1-7):C25D3/38 主分类号 C25D3/38
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