Semiconductor pressure sensor including sensor chip fixed to package by adhesive,申请号US09/287012-传众专利搜索

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发明名称	Semiconductor pressure sensor including sensor chip fixed to package by adhesive
摘要
申请公布号	US6169316(A)	申请公布日期	2001.01.02
申请号	US09/287012	申请日期	1999.04.06
申请人		发明人
分类号		主分类号
代理机构		代理人
主权项
地址

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