DEVICE AND METHOD FOR MAKING DEVICES COMPRISING AT LEAST A CHIP FIXED ON A SUPPORT

摘要

The invention concerns a method for mounting on a support (16) at least a microcircuit in the form of a chip (2) produced on a very thin semiconductor substrate. The invention is characterised in that it comprises, for the or each chip, the following steps: a) providing at the chip at least an interconnection point in the form of a bump contact (8) in weldable material, the bump contact having a welding surface in the same plane as at least one of the chip faces (2a); b) providing at the level of the support at least an interconnection pad (14a) designed to be welded with a corresponding bump contact of the chip; c) placing the welding face of the or of each bump contact of the chip opposite the or each corresponding interconnection pad of the support; and d) welding the or each bump contact of the chip with the or each corresponding interconnection pad of the support. The invention also concerns a device, such as a chip card, produced from a chip as defined at point a).