| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for cutting a protective tape for the surface of a wafer used for processing the rear surface of the wafer by which the tape base material is not processed at the same time as during processing of the rear surface, even if the wafer has an extremely small final thickness, and no loading will occur in a grinding stone. SOLUTION: A wafer 1 is sucked on a placing table of a tape attacking device, while the semiconductor device is mounted with surface faced up and the rear surface faced down. Then, a protective tape 2 is arranged on the wafer, while its adhesive agent 4 side is placed faced down, and it is pressed down to the wafer by an elastic rotary roller, etc., so as to be attached thereto. At this time, the tape 2 is also attached to a part of peripheral chamfered part, as well as the flattened part of the surface of the wafer. Furthermore, a cutting tool 5 is inclined at an angle calculated, on the basis of the shape of the chamfered part of the wafer 1 and the final thickness of the wafer 1, and in such a state that, the cutting tool 5 is turned on the center line of the wafer 1 as an axis, so that the tape 2 is cut along the outer diameter of the wafer 1. Thus, the tape 2 is cut at a required and minimum size.</p> |
