| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus and a method, for the inspection of a bonding operation, in which the inspection accuracy of a three-dimensional shape including the height direction can be enhanced in the X-ray inspection of the electrode joint part of a mounted electronic component. SOLUTION: An X-ray generator 111, an X-ray scintillator 115, an imaging device 120 and a control device 121 are provided. First calibration information which indicates a relationship between the thickness of a joint part obtained by using an instruction jig 125 and the brightness of a radioscopy image is stored in the control device in advance. Regarding the radioscopy image of a mounted part supplied from the imaging device, thickness information in the joint part inside the mounted part is generated by using the first calibration information. Thereby, the inspection accuracy of a three-dimensional shape including the height direction in the joint part can be enhanced.
|
