| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a circuit board which can easily and securely expose a positioning mark and improve the manufacturing yield. SOLUTION: The manufacturing method of a circuit board includes a sheet arranging process for overlapping a 1st interposing sheet 22 on a 1st positioning mark 12 of a laminated substrate 11 and projecting part of it from the peripheral edge 11C of the laminated substrate 11, an insulating layer and metal layer forming process for forming a resin insulating layer 25 and a metal layer 26 on the top surface 11A of the laminated substrate 11 and the 1st positioning mark 12 of the 1st interposing sheet 22, and a peeling process for exposing the 1st positioning mark 12 by peeling the 1st interposing sheet 22 off the laminated substrate 11 together with the resin insulating layer 25 and metal layer 26 on the 1st interposing sheet 22. |
