| 摘要 |
PROBLEM TO BE SOLVED: To raise dimension precision in insulating layer thickness of a build-up layer by using a prepreg of a glass fiber base material where a hole is opened in advance at a point corresponding to a via hole as an insulating layer, and heating and pressurizing a conductor pattern formed on a metal plate onto a core-layer printed wiring board for transfer. SOLUTION: A glass fiber base material prepreg 7 where a hole 8 is opened at a via hole position of a build-up layer by drilling, etc., is used as an insulating layer. Then, with a core layer 4 as a center, stainless plates 1 and 1' wherein a build-up layer conductor pattern 3 is formed on both front and rear sides are arrayed through glass fiber base material prepregs 7 and 7' with hole opened, and stacked using an alignment hole. These are laminated applying heat and pressure. Since, with this configuration, the glass fiber base material prepreg 7 can be used for a build-up layer, the dimension precision in an insulating layer thickness of the build-up layer is raised. |
