| 摘要 |
PROBLEM TO BE SOLVED: To reduce the total thickness including solder, etc., when mounting by providing a channel on a bottom surface, and forming a terminal electrode connected to a lead-out terminal of an inner element only on the inner surface of the channel. SOLUTION: Each terminal electrode 3 comprises a conductor along the inner surface of a channel 4 at both ends of the channel 4 provided on a bottom surface 12 of a laminated electronic part 1. The laminated electronic part 1 is prevented from rising caused by solder 7, because the channel 4 covered with the terminal electrode 3 is filled with the solder 7 when it is fitted to a land 6 formed on a printed board 5 with the solder 7. Thus, the increase in total thickness of the laminated electric part 1 on the printed board 5 comprising the solder 7 is suppressed. Since the rising of the laminated electric part 1 due to the solder 7 is prevented, defective connection at a part with less solder amount is prevented.
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