| 摘要 |
PROBLEM TO BE SOLVED: To reduce the foot prints of a semiconductor manufacturing device even if a wafer size is increased. SOLUTION: A semiconductor manufacturing device provided with a process chamber 13, wherein a wafer 20 having the height in the vertical direction lower than the maximum diameter in the horizontal direction is heat-treated, a transfer means 11 for transferring the wafer 20 and a transfer chamber 10 for housing the means 11, is constituted into such a structure that the chamber 13 is arranged on the upper part of the above chamber 10 and when the wafer 20 is carried in the chamber 13 or is carried out from the chamber 13, a wafer mounting part in the chamber 13 is descended in the chamber 10. |
