MANUFACTURE OF SEMICONDUCTOR PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor package, where fine patterns can be formed, at a low cost. SOLUTION: Prepregs 105a and 105b are adhered by a vacuum press method to both surfaces of a resin substrate 101 where internal-layer patterns 103a and 103b are formed. Then the prepregs 105a and 105b are plated with copper by an electroless and an electrolytic method without sticking copper foil on the prepregs 105a and 105b. Then the formed layer of copper is etched to form an external-layer pattern.