WIRING FORMING METHOD AND DEVICE, WIRING AND INTEGRATED CIRCUIT

摘要

PROBLEM TO BE SOLVED: To provide a wiring forming method which is capable of filling a hole (connection hole) bored in an insulating body sufficiently with conductive material preventing voids. SOLUTION: A connection hole is formed through a connection hole forming process and a cleaning process, and the inner wall surface of the connection hole is made to adsorb material (active site) which has a chemical affinity through a surface treatment process S1. Then, material which has properties to donate electrons making active sites serve as nucleuses is deposited as a film on the surface of the connection hole through an electron-donating film forming process S2. Then, a wiring material is filled into the connection hole through a filling process S3.