| 摘要 |
PROBLEM TO BE SOLVED: To obtain the subject composition excellent in tackiness to various adherends, and having excellent re-releasability and stain resistance after cured with ultraviolet rays, or the like, and usuful for temporary adhesion as that in e.g. a process of dicing semiconductor wafers, by including a hydrophilic acrylic adhesive, an active energy ray-curable compound, and the like. SOLUTION: This composition is obtained by including (A) a hydrophilic acrylic adhesive, (B) an active energy ray-curable compound comprising pref. a hydrophilic urethane acrylate oligomer, (C) a photopolymerization initiator such as a 1-hydroxycyclohexyl phenyl ketone, and (D) a crosslinking agent pref. so that the weight ratio of the component A to the component B is (95:5) to (30:70), and the components C and D are at 0.5 to 5.0 pts.wt. and 0.01 to 4 pts.wt., respectively, each based on the total of 100 pts.wt. of the components A and B. the component A is pref. a neutralized product of a copolymer made from an unsaturated monomer containing a carboxyl group, or the like (e.g. acrylic acid) and a monomer copolymerizable therewith such as butyl acrylate.
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