| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a printed wiring board, where the existence and stress distortion on not only the surface layer part of the board but also on an inner layer part are measured and various influences by means of distortion can be dissolved at measuring the state change of a distortion gauge due to distortion by stresses in the printed wiring board. SOLUTION: In a printed wiring board 1 formed of a board 3, where plural insulating boards 2 are stacked and a conductor pattern formed on the surface layer of the board 3, metal foil 10 whose conductor resistance change is large is buried in the inner layer of the board 3. Measuring electrodes 15 for connecting them to metal foil 10 are arranged on the surface of the board 3.</p> |
