| 摘要 |
PROBLEM TO BE SOLVED: To obtain a surface treating method for inner layer circuit boards, wherein inner layer circuit boards having uniform and satisfactory appearance can be obtained with high productivity. SOLUTION: A rolled elongated inner layer circuit board 1 is transferred, being unrolled. Being transferred in this way, the innerboard 1 has circuit on its surface subjected to oxidation process using a processing solution. The board 1 is transferred with a tension applied thereto adjusted to 1-50 kgf. The circuits on the elongated inner layer circuit board 1 can be subjected continuously to the oxidation process. Further, flections and positional deviations of the board 1 can be reduced, whereby not only the board 1 is prevented from coming in contact with other parts and regions, but also hooking of the board 1 can be reduced. |
