| 摘要 |
PROBLEM TO BE SOLVED: To efficiently cool an IC by reducing constitutive members required for heat radiation to restrain generation of stress and deflection. SOLUTION: This IC cooler is composed of an IC 1, a heat transfer strut 2, a fixing spacer 3, a spring 4, a cooling block 6, cooling pipes 7 and screws 24. A heat-conductive material 5a is applied on a package part 1a in an upper face of the IC 1, and a heat-conductive material 5b is applied also onto a contact face contacting with the strut 2 in an insertion hole 6a for the strut 2 provided in the cooling block 6. The block 6 is fixed to a printed circuit board by the fixing spacer 3, the spring 4 is attached to the cooling block 6 by the two screws 24, 24 and tapped holes 6b provided in two portions in an upper face of the block 6, and is fixed to press an upper face of the heat transfer strut 2 downwards by spring pressure.
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