| 摘要 |
PROBLEM TO BE SOLVED: To obtain a lead frame for a semiconductor device of a structure, where a short-circuit between a die pad and each lead pin and bridges due to solder are prevented from being generated and also an IC chip of a comparatively wide area can be mounted on the die pad, and the semiconductor device using this lead frame. SOLUTION: This lead frame 20 is formed into a structure, where rear retreated parts 213 are respectively formed of each of step surfaces retreated from the rear of the central part 212 of a die pad 21 on the rear surfaces of the peripheral parts 211 of the die pad 21, rear retreated parts 123 are respectively formed of each of step surfaces retreated from the rear surfaces of the point parts 121 of lead pins 12 also on the rear surface of the base end part 122 of each lead pin 12 on the sides of the peripheral parts 211 of the die pad 21, a large-area IC chip 2 can be mounted on the large-area die pad 21 and in the case, where the chip 2 is mounted on the pad 21 and is sealed with a resin 4 and a semiconductor device 1A is formed, the width of the interval between the pad 21 under the rear of the chip 2, and the lead pins 12 can be taken wide. |
