APPARATUS FOR MANUFACTURING KNOWN GOOD DIE

摘要

PURPOSE: An apparatus for manufacturing a KGD(Known Good Die) is provided to manufacture a KGD by using a package structure of an existing package type. CONSTITUTION: A body portion(29) of a carrier(20) is formed with a chip mount area(25) and a plurality of vacuum absorption hole(27). An inner connection terminal(21) is extended to a bottom face(26a) of the chip mount area(25) and connected to a bare chip(10). An outer connection terminal(23) is extended to the outside of the body portion(29). A cover(30) covers the chip mount area(25) and fixes the bare chip(10). A buffering portion(34,35) is adhered to one side of the cover(30). A stopper opens or shuts the vacuum absorption hole(27) to contact closely the cover(30) with the bare chip(10).