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发明名称
WAFER POLISHING APPARATUS USING LIQUID TYPE POLISHING SOLUTION
摘要
申请公布号
KR200191625(Y1)
申请公布日期
2000.12.01
申请号
KR19960057284U
申请日期
1996.12.26
申请人
HYUNDAI MICRO ELECTRONICS CO., LTD.
发明人
SHIN, HEETAE
分类号
H01L21/302
主分类号
H01L21/302
代理机构
代理人
主权项
地址
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