| 摘要 |
PROBLEM TO BE SOLVED: To surely clean the solder bump forming surface of a wafer-level chip size (scale) package (CSP) which is formed in the level of a wafer. SOLUTION: After solder bumps are formed on a wafer 13 and the bumps are reflowed, the wafer 13 is held by a spin chuck and rotated. The solder bump forming surfaces 10 of the wafer 13 are heated by blowing steam upon the surfaces 10 from a nozzle 16. When the surfaces 10 are heated, the residues of flux 11, scattered solder 12, etc., become soft. Then the residues are washed away by jetting a washing solution upon the softened residues with a high pressure.
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