| 摘要 |
PROBLEM TO BE SOLVED: To enable sure mounting of the necessary number of solder balls on a package without forming dimples on a ball suction surface of an alignment mask. SOLUTION: This conductive ball mounting equipment is constituted by installing a ball supply part which levitates and supplies solder balls, a flux supply part spreading flux on the solder balls, a mounting part positioning a package, an alignment mask connected with a vacuum pressure supply source in which mask a plurality of holes for sucking the solder balls are formed in the same arrangement as that of connecting terminals of the package, and a carrying part moving the alignment mask. In this case, vacuum pressure setting devices 11a, 11b, 11c are installed between a vacuum pressure supplying source 8 and an alignment mask 6.
|
