| 摘要 |
<p>PROBLEM TO BE SOLVED: To eliminate the need for external force for chucking a wafer. SOLUTION: This apparatus is composed of a chuck base 6 for mounting a wafer 11 held by holding means and a vertically movable top-opened cup 4 surrounding the chuck base 6. The holding means comprises wafer guides 8 projecting from the chuck base 6 for mounting the wafer 11 and clamp arms 9 each formed at the wafer guide 8 for elastically pressing the wafer 11 to a guide face 8a perpendicular to the chuck base 6 surface, and the clamp arms 9 are rotatably mounted through support pins 10 at the chuck base 6 end and have arm drives 15 projecting at the lower side of the support pins 10 and guide members 16 for rotating the clamp arms 9, by sliding or rolling the arm drives 15 inside the cup 4.</p> |
