LEAD FRAME MEMBER WITH HEAT DISSIPATION PLATE AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To obtain a semiconductor device having a structure for enhancing heat dissipation by mounting a semiconductor element on a heat dissipation plate and bonding the forward end part of the inner lead in a lead frame to the heat dissipation plate through an adhesive layer. SOLUTION: Forward end part 111A of the inner lead in a lead frame 110 is secured to a heat dissipation plate 120 through an adhesive layer 130 of liquid crystal polymer arranged on one side thereof. The lead frame and the heat dissipation plate are made of copper or copper alloy and the liquid crystal polymer has coefficient of thermal expansion in the range of 15-20 ppm/ deg.C, water absorbance of 0.2% or less at 23 deg.C after immersion into water for 24 hours, and liquid crystal transition point in the range of 270-360 deg.C.