| 发明名称 |
ROBUST INTERCONNECT STRUCTURE |
| 摘要 |
A structure comprising a layer of copper (1), a barrier layer (10), a layer of AlCu (9), and a pad-limiting layer (7), wherein the layer of AlCu and barrier layer are interposed between the layer of copper and pad-limiting layer. |
| 申请公布号 |
WO0072380(A1) |
申请公布日期 |
2000.11.30 |
| 申请号 |
WO2000GB01847 |
申请日期 |
2000.05.15 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION;IBM UNITED KINGDOM LIMITED |
发明人 |
EDELSTEIN, DANIEL;MCGAHAY, VINCENT;NYE, HENRY;OTTEY, BRIAN;PRICE, WILLIAM |
| 分类号 |
H01L23/52;H01L21/3205;H01L21/60;H01L23/485;(IPC1-7):H01L23/485;H01L23/532 |
主分类号 |
H01L23/52 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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