SEMICONDUCTOR LIGHT-EMITTING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an assembly structure for conductive mounting to a lead frame, which copes with size-reduction of a semiconductor light-emitting element. SOLUTION: A pair of electrodes 5 and 6 are formed on a mount cup 4 of synthetic resin integrally, and a semiconductor light-emitting element 1 is so mounted as to be conductive to the electrodes 5a and 6. Further, the mount cup 4 is so mounted on leads 3a and 3b of a lead frame 3 as to be conductive to the electrodes 5 and 6 so that the interval between the electrodes 5 and 6 provided to the mount cup 4 is shortened, coping with the conductive mounting of the small semiconductor light-emitting element 1.