Apparatus for grinding the edges of semiconductor disks or wafers

摘要

The apparatus has a central grinding device (1) which carries at least two rotating grinding tools. The apparatus can be positioned on and fixed to the wafer by at least two delivery devices (2) which are arranged near the apparatus and are independently programmable. Each delivery device has a plate or table (6) which is rotatable and longitudinally displaceable. By displacing the table longitudinally, the edge of the wafer is guided against one of the grinding tools. The delivery devices are programmed such that they supply at least two semiconductor wafers at the same time for the edges to be ground. Independent claims also cover a method of grinding using the apparatus.