| 摘要 |
PURPOSE: An apparatus for electrically connecting semiconductor device is provided so that a parasite component can be minimized and then a radio frequency signal can be transmitted without a loss by constructing two electrical paths transmitting an electrical signal. CONSTITUTION: An apparatus for electrically connecting semiconductor device consists of several devices. A contact(200) functions as an electrical connection line between a lead(11) of DUT(Device Under Test)(10) and a pattern(31) of a test board(30). The contact(200) has the first and second electrical paths(ABCD,AEFD) for transmitting a signal between the DUT(10) and the test board(30). The first electrical path(ABCD) is formed through the points of A,B,C and D, and the second electrical path(AEFD) is formed through the points of A,E,F and D. The contact(200) has an integrated structure including the first bar(B-E) having the point of A as a center point, the second bar(C-D) having the point of B as a center point, the third bar(B-C) for connecting the points of B and C positioned to ends of the first and second bars, and the fourth bar(E-F) for connecting the points of E and F positioned to the other ends of the first and second bars(B-E,C-D).
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