| 摘要 |
PURPOSE: A handler finger of a robot arm for transferring a wafer is provided to prevent damage to the wafer when a wafer is transferred in a production line, by making the entire thickness of a body including a vacuum absorbing line thin. CONSTITUTION: A wafer is settled on a settlement surface. A plurality of vacuum absorbing holes absorb the wafer in a vacuum state while being in contact with the wafer. A plurality of vacuum absorbing lines(12) connected to the vacuum absorbing holes are formed on a vacuum absorbing line formation surface. A body(13) includes the settlement surface, the vacuum absorbing holes and the vacuum absorbing line formation surface. A head is disposed in a front end of the body while being formed as one body with the body, and protruded in a direction opposite to the settlement surface to form a step difference of a predetermined height with the vacuum absorbing line formation surface. A cover tape(15) covers the vacuum absorbing lines, attached to the vacuum absorbing line formation surface. A handler finger(10) has the body, the head and the cover tape. The flat surface of the head is a round type, and the end of the head is sharply protruded as a triangular type.
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