发明名称 |
Hybrid frame with lead-lock tape |
摘要 |
A hybrid lead frame having leads for conventional lead-to-I/O wire bonding, and leads for power and ground bussing that extend over a surface of the semiconductor die is provided where the leads for bussing are held in place by lead-lock tape to prevent bending and/or other movement of the bussing leads during manufacturing. More specifically, the lead-lock tape is transversely attached across a plurality of bussing leads proximate to and outside of the position where the die is to be attached. |
申请公布号 |
US6146922(A) |
申请公布日期 |
2000.11.14 |
申请号 |
US19990243887 |
申请日期 |
1999.02.03 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
BROOKS, JERRY M.;KINSMAN, LARRY D.;ALLEN, TIMOTHY J. |
分类号 |
H01L23/495;(IPC1-7):H01L21/44;H01L21/48;H01L21/50 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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