发明名称 DENATURED PITCH FLUORIDE CONTAINING COMPOSITE PLATING LIQUID AND FORMATION OF COMPOSITE PLATING FILM
摘要 PROBLEM TO BE SOLVED: To enhance the water repellence of a composite plating film by incor porating a metal salt and fluorinated pitch treated by a diamine compound into the film. SOLUTION: A composite plating liquid consists of an aqueous solution prepared by dissolving the metal salt therein and dispersing the fluorinated pitch therein. The metal salt is the material for forming a metallic base material layer of composite plating film, for which salts of Ni, Cu, Zn, Sn, etc., are used. The fluorinated pitch previously treated by the diamine compound, i.e., the fluorinated pitch formed by reacting the diamine compound with the fluorinated pitch is used. The diamine compound is preferably expressed by formula, where R is 1 to 3C alkyl group and (n) is an integer from 2 to 5. N,N-dimethyl-1 and 3-propanediamine are more particularly preferable among these. The composite plating film is formed by immersing a prescribed base material into such plating liquid and applying electrolytic plating to the base material.
申请公布号 JP2000313998(A) 申请公布日期 2000.11.14
申请号 JP19990118652 申请日期 1999.04.26
申请人 OSAKA GAS CO LTD 发明人 SAITO MICHIO;YAMADA MITSUAKI
分类号 C25D15/02;(IPC1-7):C25D15/02 主分类号 C25D15/02
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