| 摘要 |
PROBLEM TO BE SOLVED: To remarkably improve the adhesion between a resin/metal at the time of applying electroless plating of metal (such as copper) on a resin at the time of producing a printed circuit board or the like. SOLUTION: A thermosetting resin layer is heated at a temp. lower than the hardening temp. and is half-hardened, this resin layer is applied with a catalyst for electroless plating, is next treated with a silane coupling agent soln. to adsorb silane coupling on the surface and is then applied with electroless plating, and the resin layer is heated to the temp. equal to or above the hardening temp. and is perfectly hardened. It is possible that electroplating is applied before or after the perfect hardening thereof to secure the thickness of the plating.
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