发明名称 SPUTTERING SYSTEM
摘要 PROBLEM TO BE SOLVED: To prolong the usable period of deposition preventive boards for a countermeasure of dust in a sputtering system and to improve the working ratio. SOLUTION: As for a deposition preventive board 31 and a deposition preventive board 32 covering the circumference of a substrate 5, the deposition preventive board 31 works as a 1st deposition preventive part confronted with a target 1, and the deposition preventive board 32 is located on the outer circumference of the 1st deposition preventive part and works as a 2nd deposition preventive part which is not confronted with the target 1. The back face of the deposition preventive board 32 is arranged with a magnet 4 so as to form magnetic flux going from the target 1 toward the 2nd deposition preventive part, and the polarity of the pole 4a closer to the deposition preventive board 32 among the poles of the magnet 4 is set to the one same as the polarity of the pole 3a at the outside of the target in a magnetic circuit 3. Electrons applying a heat shock on the deposition preventive boards are introduced by a magnetic flux and flow into the deposition preventive board 32. The thickness of a film adhered to this part is thin, its peeling is suppressed, and the usable period of the deposition preventive boards can be prolonged.
申请公布号 JP2000313956(A) 申请公布日期 2000.11.14
申请号 JP19990118862 申请日期 1999.04.27
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 HAYATA HIROSHI
分类号 C23C14/34;(IPC1-7):C23C14/34 主分类号 C23C14/34
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