发明名称 SUPER-ABRASIVE GRAIN CUTTING WHEEL
摘要 PROBLEM TO BE SOLVED: To lower cutting resistance and to reduce dispersion and chipping of thickness of a work by covering all or a part of an exposed surface of a disc base plate made of high speed steel with a chrome plated film. SOLUTION: A high speed steel made base plate 1 is set in a mold. A diamond layer 2 is fastened on an outer peripheral surface of the high speed steel made base plate by blending diamond abrasive grains in a resin bond with polyimide resin as a main component and silicon carbide powder as a filler, filling a uniformly mixed mixture in the mold, heating and pressurizing it. This diamond layer 2 is applied with truing dressing by a dressing machine. Thereafter, this diamond layer 2 of a diamond cutting wheel and a base plate hole part are marked with insulating varnish, only both surfaces of the base plate are covered with chrome plating, a chromium plated film 4 is formed, and a resin bond diamond cutting wheel is made.
申请公布号 JP2000308971(A) 申请公布日期 2000.11.07
申请号 JP19990158473 申请日期 1999.04.26
申请人 OSAKA DIAMOND IND CO LTD 发明人 INOUE HARUO;OKANISHI YUKIO
分类号 B24D3/00;B24D3/06;B24D3/14;B24D3/28;B24D5/12;(IPC1-7):B24D3/00 主分类号 B24D3/00
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