| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board, where a connection area is enlarged, the impedance is suppressed to a low level, occurrence of GND level voltage difference between two grounds is prevented and occurrence of noise due to the voltage difference can be prevented, when it is an inner layer GND of a multilayer printed wiring board and GND in a case. SOLUTION: At least one end portion of the solid pattern 3 of an inner layer GND provided in a multilayer printed wiring board 1 is exposed on a surface, so as to be connected directly with a case GND. With this structure, a connection area of the inner layer GND of the multilayer printed wiring board and the case GND can be secured. Furthermore, the connection impedance can be made low, since the whole GND pattern of the multilayer printed wiring board 1 can be connected directly to the case GND. |
