| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for semiconductor sealing use with excellent high-temperature storability and superior in its balance with flame retardancy. SOLUTION: This epoxy resin composition essentially comprises an epoxy resin, a phenolic resin, 0.1-5 wt.% of active carbon, inorganic filler, curing promoter, 0.1-5 wt.% of bismuth oxide hydrate, and brominated epoxy resin.
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