| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC card which improves the sealing workability, eliminates the defective connection between a connecting pad and an electrode when the current process is shifted to a resin sealing process and can reduce its production cost. SOLUTION: A film serving as a component element of a wiring circuit board 20 or a sheet-like base material 22 is used as a direct sealing material. A semiconductor chip 10 is adhered and fixed to the board 20. Then a bonding tool is pressed on a connecting pad 26 to push away the material 22 located under the pad 26 by application of the ultrasonic vibrations and pressure and also to connect the pad 26 to an electrode 12 with ultrasonic waves. |
