发明名称 Asymmetric transfer molding method and an asymmetric encapsulation made therefrom
摘要 A method of encapsulating an article having first and second surfaces, includes positioning a first molding section in a sealing relationship with the first surface of the article and positioning a second molding section adjacent the second surface of the article. The first molding section is filled first thereby forcing the second surface of the article into a sealing engagement with the second molding section. The second molding section is then filled.
申请公布号 US6143581(A) 申请公布日期 2000.11.07
申请号 US19990255554 申请日期 1999.02.22
申请人 MICRON TECHNOLOGY, INC. 发明人 JOHNSON, MARK S.;BOLKEN, TODD O.
分类号 H01L21/00;H01L21/56;H01L23/29;H01L23/31;(IPC1-7):H01L21/00 主分类号 H01L21/00
代理机构 代理人
主权项
地址