发明名称 |
Asymmetric transfer molding method and an asymmetric encapsulation made therefrom |
摘要 |
A method of encapsulating an article having first and second surfaces, includes positioning a first molding section in a sealing relationship with the first surface of the article and positioning a second molding section adjacent the second surface of the article. The first molding section is filled first thereby forcing the second surface of the article into a sealing engagement with the second molding section. The second molding section is then filled.
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申请公布号 |
US6143581(A) |
申请公布日期 |
2000.11.07 |
申请号 |
US19990255554 |
申请日期 |
1999.02.22 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
JOHNSON, MARK S.;BOLKEN, TODD O. |
分类号 |
H01L21/00;H01L21/56;H01L23/29;H01L23/31;(IPC1-7):H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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