发明名称 CIRCUIT BOARD, BATTERY PACK, AND METHOD OF MANUFACTURING CIRCUIT BOARD
摘要 A circuit board (10) comprises a first substrate (11) with a predetermined wiring pattern (16) and a second substrate (12) with a predetermined wiring pattern (17), and they are connected together electrically and/or mechanically and bent in the connection. The connection includes a foldable joint material (13) composed of a thin base film (20) holding a plurality of parallel leads (14), and the joint material (13) connects the first and second substrates (11, 12) together.
申请公布号 WO0065888(A1) 申请公布日期 2000.11.02
申请号 WO2000JP02571 申请日期 2000.04.19
申请人 ROHM CO., LTD.;NAKAMURA, SATOSHI 发明人 NAKAMURA, SATOSHI
分类号 H01M10/42;H05K1/14;H05K3/20;H05K3/28;H05K3/36;(IPC1-7):H05K1/14;H01M2/10 主分类号 H01M10/42
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