发明名称 |
CIRCUIT BOARD, BATTERY PACK, AND METHOD OF MANUFACTURING CIRCUIT BOARD |
摘要 |
A circuit board (10) comprises a first substrate (11) with a predetermined wiring pattern (16) and a second substrate (12) with a predetermined wiring pattern (17), and they are connected together electrically and/or mechanically and bent in the connection. The connection includes a foldable joint material (13) composed of a thin base film (20) holding a plurality of parallel leads (14), and the joint material (13) connects the first and second substrates (11, 12) together. |
申请公布号 |
WO0065888(A1) |
申请公布日期 |
2000.11.02 |
申请号 |
WO2000JP02571 |
申请日期 |
2000.04.19 |
申请人 |
ROHM CO., LTD.;NAKAMURA, SATOSHI |
发明人 |
NAKAMURA, SATOSHI |
分类号 |
H01M10/42;H05K1/14;H05K3/20;H05K3/28;H05K3/36;(IPC1-7):H05K1/14;H01M2/10 |
主分类号 |
H01M10/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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