| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for sealing the through-hole of a resin substrate with resin. SOLUTION: In a method for sealing a through-hole, a resin pin 70 whose outer diameter is made smaller than the hole diameter of a through-hole 30 formed at a resin substrate 20, whose length is made longer than the height of the through-hole 30, and whose volume is made the same as the capacity of the through-hole 30 is inserted into the through-hole 30. Then, the resin pin 70 is softened so that the resin pin 70 can be crushed in the axial direction, and the upper and lower edge faces of the resin pin 70 are crushed like planes so that the through-hole 30 can be closed and sealed with the resin pin 70. Also, the upper and lower edge faces of the resin pin 70 crushed like planes are positioned at the same planes as the upper and lower faces of the resin substrate 20. Afterwards, the resin pin 70 with which the through-hole 30 is sealed is hardened.
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